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Thick copper

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Product Details 
后铜板 
材料： FR4 Tg170
板厚： 3.5mm
铜厚  外层： 105um
         内层：105um
最小孔径：0.5mm
表面处理：沉金

PCB Capabilities

Standard PCB Capabilities
Advanced/Premium PCB Capability
STH/ SCO/Aluminum Capability

PCBA Capabilities

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PCB Assembly Process
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Fast Turnkey PCB Assembly
Files Requested for PCBA

SMD Stencil

SMD Stencil

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