NEW TRIUNION PCB Capabilities

NEW TRIUNION PCB has prototype PCB,PCB Production fabrication and pcb assembly capabilities.

SS board Capacity

Minimum conductor width 0.15mm
Minimum conductor space
0.15mm
Minimum punching hole's diameter (FR-4) 〼2mm
Minimum punching hole's diameter (CEM-3)
〼0.8mm
Minimum punching hole's diameter (CEM-1)
0.7mm
Paper base minimum punching hole's diameter (XPC/FR-1/FR-2/ETC) (1.5x2.0)mm
Minimum punching abnormal shape groove (FR-4) (0.8x1.2)mm
Minimum punching abnormal shape groove (CEM-3/CEM-1)
0.3mm
Minimum punching abnormal shape groove (Paper base boaed)
(0.8x1.0)mm
CNC minimum diameter of hole 0.38mm
CNC minimum abnormal shape groove.
(0.8x1.0)mm
USA ULSecurity Certificate minimum thickness
0.38mm
Finished voard's maximum size. 650mmx490mm
E-test maximum holes. 4096
SMT E-test minimum space of foot 0.5mm
Carbon ink jumper resistance <30Ω (PER SQ.AREA)
Surface treatment HASL(lead and lead-free) oxidation-resistant 

DS board Capacity

Base material FR-4;Fr-5;CEM-1;CEM-3;Aluminium base PCB,halogen-free FR-4
Maximum size of DS-board 610mmx440mm
Minimum diameter size of plating hole 0.2mm
Minimum conductor width 0.1mm
Minimum conductor space 0.1mm
Solder mask's color Green / Blue / Black / Yellow
The colour of word printing White / Black / Blue
Character minimum width 0.125mm
Wall of hole's plating average thickness 25μm
Plate of wall if hole minimum thickness 20μm
Surface treatment HASL (lead and lead-free), plating/ENIG, OSP
HASL minimum thickness 2.5μm
HASL maximum thickness
30μm
(NI-AU) nical layer maximum thickness 3μm
(NI-AU) nical layer minimum thickness
7μm
Bare board test maximum size 610mmx508mm
On-off voltage 300V
Micro-resistance test ±1mΩ
Special machine word ±0.10mm
DS-board Machine Work ≤0.75%
Laser drawing maximum area 660mmx508mm
Precision of laser 8000 line
Laser repetition precision 0.0127mm
Characteristic impedance ≥50Ω ±8%; <50Ω ±4Ω


Multi-layer boards Capacity

Feature / Year
Y2015
Y2016 Y2017
Max Layer Count(L)
10 12 16
Production Panel Size mm(inch)
483*622.3(19*24.5) 483*622.3(19*24.5) 483*622.3(19*24.5)
Min/MAx core thickness(mm)
0.05 0.05
0.05
Min Dielectric thickness(mm)
0.05
0.05
0.05
Board thickness
Min / MAx(mm) 0.3/3.2 0.18/4.2 0.18/4.2
Copper thickness μm(OZ)
105μm(3OZ) 105μm(3OZ)
140μm(4OZ)
Line width / Space,MIN
Innerlayer μm(1OZ) 89μm/89μm(3.5/3.5mil)
75μm/75μm(3/3mil)
75μm/75μm(3/3mil)
Outerlayer μm(HOZ)
100μm/100μm(4/4mil) 89μm/89μm(3.5/3.5mil) 75μm/75μm(3/3mil)
Through Via diameter
Max finished hole 6.5 6.5 6.5
Min finished hole
0.15 0.15 0.15
AR
8:1 9:1 10:1
Min BGA (mm) 0.4 0.4 0.4
Min SMT (mm)
0.4 0.4 0.4
Inner Layer Clearance
8L 0.19mm(7.5mil) 0.18mm(7mil) 0.18mm(7mil)
10-12L 0.2mm(8mil) 0.19mm(7.5mil) 0.19mm(7.5mil)
Solder mask Registration (mm)
±0.05mm ±0.05mm
±0.038mm
Impedance control tolerance ±10% ±8%
±8%
Warpage
0.75% 0.6% 0.6%
Surface treatment 0.025μm-0.10μm(1-4μinch) 0.025μm-0.10μm(1-4μinch)
0.025μm-0.10μm(1-4μinch)