Professional PCB Manufacturer in China

Details

Quantity150
Material TypeFR-4
Brand Type
Dimensions23mm x 23mm
Panelization Method1 x 1
Layers2
Thickness1.6mm
Finished Copper Thickness(outer)1oz
Inner Copper
Solder Mask ColorGreen
Silkscreen ColorCold White
Min Spacing10/10mil↑
Min Hole Size0.8mm↑
VIA ProcessTenting Vias
Surface TreatmentHASL Lead Free
Test MethodFlying Probe Test

Pcb Specification

Board type :

Single pieces Panel by Customer Panel by NEWTRIUNION

Panel requirements:

Break-away rail: Yes No

(e.g. Panel in 2*3, size of the break-away rail, total 5 panels=total 30 individual boards)

Route Process:

Panel as PCBWay prefer

Panel as PCBWay prefer
Panel as V-Scoring
Panel as Tab Route
Both V-Scoring&Tab-routing

* PANEL RULE:

pcs

* Single Size:

* Single Quantity:

pcs

Area:0.00㎡

5
10
15
20
25
30
40
50
75
100
125
150
200
250
300
350
400
450
500
600
700
800
900
1000
1500
2000
2500
3000
3500
4000
4500
5000
5500
6000
6500
7000
7500
8000
9000
10000

Other：
(≥5 ㎡ to manually enter the number!)

Craft side:

None Left and right direction Up and down direction Four directions

* Process edge width:

*The minimum is 5mm

Layers:

1 Layer 2 Layers 4 Layers 6 Layers 8 Layers 10 Layers 12 Layers 14 Layers

Material:

FR-1 CEM-1 CEM-3 FR-4 Aluminum High frequency board

*Material model can be remarked below. HDI is available for 4-layer or more.

Thickness:

0.4 0.6 0.8 1.0 1.2 1.6 2.0 2.5 3.0 * Unit: mm

Thickness:

0.203 0.305 0.406 0.508 0.813 1.524 * Unit: mm

Thickness:

0.101 0.168 0.254 0.338 0.422 0.508 0.762 1.524 * Unit: mm

Solder Mask:

Green Red Yellow Blue White Black Matte black Matte green None

Silkscreen:

White Black None

Au/Ni thickness:

Au:10U"/Ni:120U"

Please choose other options of Gold /Nickel thickness here

Thickness of
ENEPIG:

Ni:200U" Pd:2U" Au:2U"

Please choose other options of Au/Pd thickness here

Thickness of
ENEPIG:

Ni:200U" Pd:2U" Au:2U"

Please choose other options of Au/Pd thickness here

Au/Ni thickness:

Au:5U"/Ni:120U"

Please choose other options of Gold /Nickel thickness here

Extra Pcb
product number :

Not to add extra Pcb product number on board (extra+$3)

Additional Options (Castellated holes,Edge Plating,impedance control...) More

We may add extra cost for these special options which will be confirmed after review.

Peelable Soldermask:

None
Top side
Bottom side

UL Marking:

None
Yes - add to top silkscreen
Yes - add to bottom silkscreen
Yes - add to top soldermask
Yes - add to bottom soldermask
Yes - add to top copper
Yes - add to bottom copper
Yes - as PCBWay default

Half-cut/Castellated Holes
Edge Plating
Impedance control
Halogen-Free
Custom Stackup
Carbon Mask
Via in pad/ Via filled with resin
Press-fit holes
Countersinks/Counterbores
Z-axis milling

+ Add PO No.

Pcb Process Information

Different Design
in a Panel :

e.g.

Finished Copper:

0.5 oz 0.75 oz 1 oz 1.5 oz 2 oz 3 oz 4 oz 5 oz

Inner Copper:

0.5 oz 1 oz 2 oz 3 oz 4 oz

Min Track/Spacing:

3/3mil 4/4mil 5/5mil 6/6mil 8/8mil 10/10mil 20/20mil ↑

Min Hole Size:

0.2mm 0.25mm 0.3mm 0.35mm 0.4mm 0.5mm 0.6mm 0.7mm 0.8mm ↑ No Drill

Plate Through Hole:

YES NO

VIA Process :

Tenting vias Plugged vias Vias not covered Resin Plug-hole

*For Gerber files, this choice is useless.It will be made according to files as default.

Test Method:

Flying Probe Test Test Rack

Surface Finish:

HASL with lead HASL lead free OSP Immersion gold Immersion Tin Bare Copper Pre-flux

Tick means you accept we might change "HASL" to "ENIG" at our discretion without extra charge.

AU:

1U" 2U" 3U"

Molding Technique:

Mechanic Molding Mold Forming

Circuit/Soldermask
Process:

Exposure Technique Silkscreen Printing

Impedance:

YES NO

Semi-Plating Hole:

YES NO

Project File Confirm:

YES NO

Test Report:

Final Inspection Report Report Of Electric Test Surface plating thickness Test Report Solderability Test Report Thermal Stress Test Report Microsection Measurement ROHS Ionic contamination Test Report

Test Report Type:

Electronic Paper

Special Techniques

Special Technique:

Chamfering Carbon ink PTH Copper Thickness 25um Blue Glue Crimp Connection Hole Blind & Buried Vias Metalization Edge HDI Customized Stack-up Silver Through Hole

Other Special request:

Material Selecting

Brand/Type:

Unspecified KB Changchun Shengyi Panasonic

Rogers:

Rogers 4003C Rogers 4350B

Thermal conductivity:

1.0W/(m⋅K) 2.0W/(m⋅K)

Structure of MCPCB:

Metal core in the middle

Metal base on the bottom side

Other Specification:

TG Value

Halogen Free

CTI Value

TG130 TG140 TG150 TG170 YES NO CTI≥175 CTI≥600

Assembly Service（Engineering and setup cost will be free iftotalcost is more than $794） The above PCBs need assembly service

Board type :

Single pieces

Single pieces
Panelized PCBs

Assembly Side(s):

Single side

Single side
Double sides

We suggest choose to do panel if single Pcb qty is more than 20pcs or any side of single board is smaller than 50mm.

* Quantity:

pcs

Stencil: Yes

Please fill in total quantity of single PCBs.

* Pcb Size (single):

Number of
Unique Parts:

Fill in to get the exact price, or leave it blank to wait for final quote.

Number of
SMT Parts:

Fill in to get the exact price, or leave it blank to wait for final quote.

Number of
Through-Hole
Parts:

Fill in to get the exact price, or leave it blank to wait for final quote.

+ Add PO No.

Additional Options More

Below options, their cost is not included in the online quotation

De-panel the boards to delivery:
- No
- Yes
Function test:
- No
- Yes
Conformal coating:
- No
- Yes
Firmware loading:
- No
Shipping package:
- Bubble bag packaging
- Shielding bag packaging
Number of X-ray test:

Detailed information
of assembly:

Price does not include Pcb fabrication or the cost of components, exact quotation will be updated after all the files you uploaded pass review or contact sale001@ntu-pcb.com for help.

Pcb Specification

Board type :

Panel requirements:

Route Process:

* PANEL RULE:

* Single Size:

* Single Quantity:

Craft side:

* Process edge width:

Layers:

Material:

Thickness:

Thickness:

Thickness:

Solder Mask:

Silkscreen:

Au/Ni thickness:

Thickness of ENEPIG:

Thickness of ENEPIG:

Au/Ni thickness:

Extra Pcb product number :

Peelable Soldermask:

Pcb Process Information

Different Design in a Panel :

Finished Copper:

Inner Copper:

Min Track/Spacing:

Min Hole Size:

Plate Through Hole:

VIA Process :

Test Method:

Surface Finish:

AU:

Molding Technique:

Circuit/Soldermask Process:

Impedance:

Semi-Plating Hole:

Project File Confirm:

Test Report:

Test Report Type:

Special Techniques

Special Technique:

Other Special request:

Material Selecting

Brand/Type:

Rogers:

Thermal conductivity:

Structure of MCPCB:

Other Specification:

Assembly Service（Engineering and setup cost will be free iftotalcost is more than $794） The above PCBs need assembly service

Board type :

* Quantity:

* Pcb Size (single):

Number of Unique Parts:

Number of SMT Parts:

Number of Through-Hole Parts:

Detailed information of assembly:

Pricing And Build Time

Please click on Calculate

Thickness of
ENEPIG:

Thickness of
ENEPIG:

Extra Pcb
product number :

Different Design
in a Panel :

Circuit/Soldermask
Process:

Number of
Unique Parts:

Number of
SMT Parts:

Number of
Through-Hole
Parts:

Detailed information
of assembly: